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Boil sump temp set – 127°F / 53°C
0 mm NA01-C30 3
Unique Features of HAKKO's IH Technology (PATENTED)
Adjustable height from bottom base to top of riser: 2
No Clean Solder Wire SAC305 (3% Flux) Size:0.8 mm Boil sump temp set –No Clean Solder Wire, 3% Flux, 250g Spool Engineered for modern electronics manufacturing, our SAC305 Solder Wire delivers outstanding soldering performance in a lead free, RoHS compliant format. Composed of 96. 5% Tin (Sn), 3. 0% Silver (Ag), and 0. 5% Copper (Cu), SAC305 is the industry preferred alloy for surface mount and through hole applications. This solder wire is pre loaded with a 3% no clean rosin based flux, which ensures fast wetting,